Product Name |
Performances |
Product Grade |
Properties |
Benzoxazine |
- Insulation
- Low water absorption
- To increase hardness
- Auxiliary flame retardant
|
ORE-0700 |
- High Tg
- Good heat resistance
- Dimensional stability
- Nitrogen content: 6.5%
|
ORE-0701 |
- Good flexibility
- Good heat resistance
- High peeling strength
- Excellent dimensional stability
|
|
Phenolic modified resins |
- Insulation
- To increase hardness
- Auxiliary flame retardant
|
ORE-0600 |
- High Tg
- Heat resistance
- High peeling strength
- Nitrogen content: 14%
|
ORE-0601 |
- Good flexibility
- Nitrogen content: 12%
- Good heat resistance
- High peeling strength
|
ORE-0603 |
- High Tg
- Nitrogen content: 19%
- Good flame retardant
- High peeling strength
- Excellent heat resistance
|
|
Phosphorous epoxy resins |
- High Tg
- Heat resistance
- Inflaming retarding
|
ORE-0301 |
- Tg >150℃
- High peeling strength
- Good heat resistance
- Phosphorus content: 2.5%
|
ORE-0302 |
- High Tg
- Heat resistance
- High peeling strength
- Phosphorus content: 3.0%
|
ORE-0303 |
- Tg >150℃
- High peeling strength
- Good heat resistance
- Phosphorus content: 4.0%
|
|
Low Dk resins |
|
EP-2101 |
- Tg>200℃
- Dk 3.8, Df 0.008
- High peeling strength
- Good impact property
|
EP-2102 |
- Dk 3.8
- Df 0.01
- Tg>150℃
- Good toughness
- Halogen-free system
- High peeling strength
|
|
Epoxy binder for heat sink application |
- High peeling strength
- Excellent heat resistance
|
EP-4101 |
- UL 94 Vо
- Tg 175℃
- Td 390℃
- Good heat resistance
- High filler binding capacity (over 75%)
|
EP-4102 |
- Tg 165℃
- UL 94 Vo
- Td 390℃
- Halogen-free resin
- Good heat resistance
- High filler binding capacity (over 75%)
|
|
Polyimide resins |
- High Tg
- Heat resistance
- Inflaming retarding
|
PI-3101 |
- Tg>250℃
- UL94 V1
- Td 390℃
- Excellent heat resistance
|
PI-3102 |
- Tg>250℃
- UL94 V0
- Td 420℃
- Excellent heat resistance
|
PI-3103 |
- Td 390℃
- Tg >200℃
- Non-flow
- Excellent heat resistance
|
|